Integrated circuits have the advantages of small size, low power consumption, and high stability. Not only are there a wide variety of integrated circuits, but new varieties are emerging in an endless stream. It is almost impossible to be familiar with the internal circuits of various integrated circuits, and it is not necessary in practice.
Classification by manufacturing process
Thin film integrated circuit: Thin film technology is used to manufacture circuits on ceramic or glass substrates, mainly used for high-precision, high-stability analog circuits and mixed-signal circuits.
Classification by manufacturing process
Thin film integrated circuit: Thin film technology is used to manufacture circuits on ceramic or glass substrates, mainly used for high-precision, high-stability analog circuits and mixed-signal circuits.
Thick film integrated circuit: Circuits are manufactured on ceramic substrates through screen printing technology. They have the advantages of low cost and simple process. They are often used in power amplification, power management and other applications.
Semiconductor integrated circuit: Semiconductor integrated circuit is an integrated circuit that uses semiconductor materials (such as silicon) as the main substrate and manufactures circuit components and interconnection lines through micro-processing technology (such as photolithography, etching, deposition, etc.).
Hybrid integrated circuits: Using both thin-film and thick-film processes on the same substrate to achieve higher performance and functional integration.
Classified by structure
Monolithic integrated circuit: Integrating all components and interconnections of a circuit on a single chip is the most common form of integrated circuit.
Multi-chip integrated circuits: circuits with different functions are manufactured on multiple chips, and then connected together through packaging technology to achieve higher performance or reduce costs.
Packaged integrated circuit: The manufactured chip is packaged in a casing to protect the chip and facilitate connection with external circuits.
Classified by function
Digital integrated circuit: Mainly used for processing digital signals, such as logical operations, data storage, etc. Common digital integrated circuits include logic gates, flip-flops, counters, etc.
Analog integrated circuit: used to process analog signals, such as amplification, filtering, oscillation, etc. Common analog integrated circuits include operational amplifiers, comparators, analog switches, etc.
Digital-analog hybrid integrated circuit: It contains both digital and analog circuit parts and is used to convert and process digital and analog signals. This type of integrated circuit is widely used in communications, audio processing and other fields.
Classified by structure
Monolithic integrated circuit: Integrating all components and interconnections of a circuit on a single chip is the most common form of integrated circuit.
Multi-chip integrated circuits: circuits with different functions are manufactured on multiple chips, and then connected together through packaging technology to achieve higher performance or reduce costs.
Packaged integrated circuit: The manufactured chip is packaged in a casing to protect the chip and facilitate connection with external circuits.
Classified by function
Digital integrated circuit: Mainly used for processing digital signals, such as logical operations, data storage, etc. Common digital integrated circuits include logic gates, flip-flops, counters, etc.
Analog integrated circuit: used to process analog signals, such as amplification, filtering, oscillation, etc. Common analog integrated circuits include operational amplifiers, comparators, analog switches, etc.
Digital-analog hybrid integrated circuit: It contains both digital and analog circuit parts and is used to convert and process digital and analog signals. This type of integrated circuit is widely used in communications, audio processing and other fields.
Classified by device type
According to different device types, they are mainly divided into three categories: bipolar integrated circuits, unipolar (MOS) integrated circuits or BiMOS integrated circuits. Among them, MOS integrated circuits are further divided into P-channel, N-channel, complementary symmetrical insulated gate field effect transistor integrated circuits; BiMOS integrated circuits are further divided into bipolar and PM0S combined, bipolar and NM0S combined, bipolar and CMOS integrated circuit.