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Standard Packaging Integrated Circuit Components CPU 1.375X1.375
Usage | CPU |
---|---|
Type | Pad, Sheet |
Thickness | 0.0050" (0.127mm) |
Thermal Resistivity | - |
Thermal Conductivity | 0.6 W/m-K |
Shape | Square |
Series | CPU Pad™ |
Outline | 34.93mm x 34.93mm |
Other Names | BER135 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | - |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Tan 34.93mm x 34.93mm Square |
Color | Tan |
Backing, Carrier | - |
Adhesive | - |