In stock: 58050
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Standard Packaging Integrated Circuit Components 10018783-00111TLF
Termination | Solder, Staggered |
---|---|
Series | - |
Read Out | Dual |
Pitch | 0.039" (1.00mm) |
Packaging | Tray |
Operating Temperature | -55°C ~ 85°C |
Number of Rows | 2 |
Number of Positions/Bay/Row | - |
Number of Positions | 64 |
Mounting Type | Through Hole |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material - Insulation | Polyamide (PA), Nylon, Glass Filled |
Manufacturer Standard Lead Time | 12 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Gender | Female |
Flange Feature | - |
Features | Board Guide, Locking Ramp |
Contact Type | - |
Contact Material | Copper Alloy |
Contact Finish Thickness | 30.0µin (0.76µm) |
Contact Finish | Gold or Gold, GXT™ |
Color | White |
Card Type | PCI Express™ |
Card Thickness | 0.093" (2.36mm) |