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Standard Packaging Integrated Circuit Components XCZU2CG-1SFVA625I
Supplier Device Package | 625-FCBGA (21x21) |
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Speed | 500MHz, 1.2GHz |
Series | Zynq® UltraScale+™ MPSoC CG |
RAM Size | 256KB |
Primary Attributes | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
Peripherals | DMA, WDT |
Packaging | Tray |
Package / Case | 625-BFBGA, FCBGA |
Operating Temperature | -40°C ~ 100°C (TJ) |
Number of I/O | 180 |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Manufacturer Standard Lead Time | 10 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Flash Size | - |
Detailed Description | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 103K+ Logic Cells 256KB 500MHz, 1.2GHz 625-FCBGA (21x21) |
Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture | MCU, FPGA |