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Standard Packaging Integrated Circuit Components 530001B02500G
Width | 1.650" (41.91mm) |
---|---|
Type | Board Level, Vertical |
Thermal Resistance @ Natural | 8.00°C/W |
Thermal Resistance @ Forced Air Flow | 2.00°C/W @ 300 LFM |
Shape | Rectangular, Fins |
Series | - |
Power Dissipation @ Temperature Rise | 20.0W @ 60°C |
Package Cooled | TO-218 |
Other Names | 042663 HS385 |
Moisture Sensitivity Level (MSL) | Not Applicable |
Material Finish | Black Anodized |
Material | Aluminum |
Manufacturer Standard Lead Time | 7 Weeks |
Length | 2.500" (63.50mm) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Height Off Base (Height of Fin) | 1.000" (25.40mm) |
Diameter | - |
Detailed Description | Heat Sink TO-218 Aluminum 20.0W @ 60°C Board Level, Vertical |
Attachment Method | Bolt On and PC Pin |