Label and body marking of BOND PLY 660P 11X12" can be provided after order.
In stock: 59789
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Standard Packaging Integrated Circuit Components BOND PLY 660P 11X12"
Usage | - |
---|---|
Type | Sheet, Tape |
Thickness | 0.0080" (0.203mm) |
Thermal Resistivity | 0.81°C/W |
Thermal Conductivity | 0.4 W/m-K |
Shape | Rectangular |
Series | Bond-Ply® 660P |
Outline | 304.80mm x 279.40mm |
Other Names | BOND PLY 660P 11X12"-ND BONDPLY660P11X12" Q4936915 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Polyimide |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Brown 304.80mm x 279.40mm Rectangular Adhesive - Both Sides |
Color | Brown |
Backing, Carrier | Polyimide |
Adhesive | Adhesive - Both Sides |