In stock: 59616
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Standard Packaging Integrated Circuit Components TXBF-019-025B
Width | - |
---|---|
Type | Top Mount |
Thermal Resistance @ Natural | 150.00°C/W |
Thermal Resistance @ Forced Air Flow | - |
Shape | Cylindrical |
Series | Fan Top |
Power Dissipation @ Temperature Rise | - |
Package Cooled | TO-18 |
Other Names | 294-1004 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material Finish | Black Cadmium |
Material | Beryllium Copper |
Length | - |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant |
Height Off Base (Height of Fin) | 0.250" (6.35mm) |
Diameter | 0.500" (12.70mm) OD |
Detailed Description | Heat Sink TO-18 Beryllium Copper Top Mount |
Attachment Method | Press Fit |