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Standard Packaging Integrated Circuit Components XCZU4EG-3FBVB900E
Supplier Device Package | 900-FCBGA (31x31) |
---|---|
Speed | 600MHz, 1.5GHz |
Series | Zynq® UltraScale+™ MPSoC EG |
RAM Size | 256KB |
Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
Peripherals | DMA, WDT |
Packaging | Tray |
Package / Case | 900-BBGA, FCBGA |
Operating Temperature | 0°C ~ 100°C (TJ) |
Number of I/O | 204 |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Manufacturer Standard Lead Time | 10 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Flash Size | - |
Detailed Description | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 192K+ Logic Cells 256KB 600MHz, 1.5GHz 900-FCBGA (31x31) |
Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture | MCU, FPGA |