Label and body marking of HSF-50-19-B-F can be provided after order.
In stock: 59679
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Standard Packaging Integrated Circuit Components HSF-50-19-B-F
Width | 1.969" (50.00mm) |
---|---|
Type | Top Mount |
Thermal Resistance @ Natural | 1.31°C/W |
Thermal Resistance @ Forced Air Flow | - |
Shape | Square, Fins |
Series | HSF |
Power Dissipation @ Temperature Rise | - |
Package Cooled | BGA |
Other Names | 345-1615 |
Moisture Sensitivity Level (MSL) | Not Applicable |
Material Finish | Black Anodized |
Material | Aluminum Alloy |
Manufacturer Standard Lead Time | 12 Weeks |
Length | 1.969" (50.00mm) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Height Off Base (Height of Fin) | 1.555" (39.50mm) |
Diameter | - |
Detailed Description | Heat Sink BGA Aluminum Alloy Top Mount |
Attachment Method | Clip |