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Standard Packaging Integrated Circuit Components XCZU19EG-L2FFVD1760E
Supplier Device Package | 1760-FCBGA (42.5x42.5) |
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Speed | 533MHz, 600MHz, 1.3GHz |
Series | Zynq® UltraScale+™ MPSoC EG |
RAM Size | 256KB |
Primary Attributes | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Peripherals | DMA, WDT |
Packaging | Tray |
Package / Case | 1760-BBGA, FCBGA |
Operating Temperature | 0°C ~ 100°C (TJ) |
Number of I/O | 308 |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Manufacturer Standard Lead Time | 10 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Flash Size | - |
Detailed Description | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells 256KB 533MHz, 600MHz, 1.3GHz 1760-FCBGA (42.5x42.5) |
Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture | MCU, FPGA |