Label and body marking of TG404F-200-200-0.3 can be provided after order.
In stock: 50764
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Standard Packaging Integrated Circuit Components TG404F-200-200-0.3
Usage | - |
---|---|
Type | Sheet |
Thickness | 0.0120" (0.305mm) |
Thermal Resistivity | - |
Thermal Conductivity | - |
Shape | Square |
Series | TG |
Outline | 200.00mm x 200.00mm |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | - |
Manufacturer Standard Lead Time | 12 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad 200.00mm x 200.00mm Square |
Color | - |
Backing, Carrier | - |
Adhesive | - |