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Standard Packaging Integrated Circuit Components HF115AC-0.0055-AC-90
Usage | TO-218, TO-220, TO-247 |
---|---|
Type | Pad, Sheet |
Thickness | 0.0055" (0.140mm) |
Thermal Resistivity | 0.35°C/W |
Thermal Conductivity | 0.8 W/m-K |
Shape | Rectangular |
Series | Hi-Flow® 115-AC |
Outline | 21.84mm x 18.79mm |
Other Names | BER169 BG428814 HF115AC-90 HF115AC00055AC90 HF115TAAC-90 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Phase Change Compound |
Manufacturer Standard Lead Time | 2 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Gray 21.84mm x 18.79mm Rectangular Adhesive - One Side |
Color | Gray |
Backing, Carrier | Fiberglass |
Adhesive | Adhesive - One Side |