In stock: 54767
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Standard Packaging Integrated Circuit Components BDN11-3CB/A01
Width | 1.110" (28.19mm) |
---|---|
Type | Top Mount |
Thermal Resistance @ Natural | 20.90°C/W |
Thermal Resistance @ Forced Air Flow | 7.20°C/W @ 400 LFM |
Shape | Square, Pin Fins |
Series | BDN |
Power Dissipation @ Temperature Rise | - |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Other Names | 294-1109 BDN113CB/A01 BDN113CBA01 BDN123CBA01 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material Finish | Black Anodized |
Material | Aluminum |
Manufacturer Standard Lead Time | 14 Weeks |
Length | 1.110" (28.19mm) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Height Off Base (Height of Fin) | 0.355" (9.02mm) |
Diameter | - |
Detailed Description | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount |
Attachment Method | Thermal Tape, Adhesive (Included) |