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Standard Packaging Integrated Circuit Components PA-TS1D6SM18-32
Size / Dimension | 1.650" L x 0.750" W (41.91mm x 19.05mm) |
---|---|
Series | - |
Proto Board Type | SMD to DIP |
Pitch | 0.020" (0.50mm) |
Package Accepted | TSOP |
Other Names | 309-1103 PATS1D6SM1832 |
Number of Positions | 32 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | - |
Manufacturer Standard Lead Time | 4 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Board Thickness | - |