Label and body marking of THINC23-21.5-11.4-5.8-0.8 can be provided after order.
In stock: 51168
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Standard Packaging Integrated Circuit Components THINC23-21.5-11.4-5.8-0.8
Usage | - |
---|---|
Type | Interface Cap |
Thickness | 0.0315" (0.800mm) |
Thermal Resistivity | - |
Thermal Conductivity | 1.9 W/m-K |
Shape | Rectangular |
Series | THINC |
Outline | 21.50mm x 11.40mm x 5.80mm |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Silicone |
Manufacturer Standard Lead Time | 12 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Gray 21.50mm x 11.40mm x 5.80mm Rectangular |
Color | Gray |
Backing, Carrier | - |
Adhesive | - |