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Standard Packaging Integrated Circuit Components HIFLOW-105-AC-1.8X.74
Usage | - |
---|---|
Type | - |
Thickness | - |
Thermal Resistivity | - |
Thermal Conductivity | - |
Shape | - |
Series | - |
Outline | - |
Other Names | BG430576 Q8020605 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | - |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad |
Color | - |
Backing, Carrier | - |
Adhesive | - |