Label and body marking of EB63-S0C286XF can be provided after order.
In stock: 58645
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Standard Packaging Integrated Circuit Components EB63-S0C286XF
Termination | Solder |
---|---|
Series | EB6 |
Read Out | Dual |
Pitch | 0.125" (3.18mm) |
Packaging | Bulk |
Other Names | EB63-C28SGXF T02 |
Operating Temperature | -65°C ~ 125°C |
Number of Rows | 2 |
Number of Positions/Bay/Row | 28 |
Number of Positions | 56 |
Mounting Type | Through Hole |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material - Insulation | Polyester Thermoplastic, Glass Filled |
Manufacturer Standard Lead Time | 18 Weeks |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant |
Gender | Female |
Flange Feature | Flush Mount, Top Opening, Unthreaded, 0.125" (3.18mm) Dia |
Features | - |
Contact Type | Cantilever |
Contact Material | Phosphor Bronze |
Contact Finish Thickness | - |
Contact Finish | Gold |
Color | Black |
Card Type | Non Specified - Dual Edge |
Card Thickness | 0.054" ~ 0.071" (1.37mm ~ 1.80mm) |