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Standard Packaging Integrated Circuit Components ATS-53375D-C1-R0
Width | 1.476" (37.50mm) |
---|---|
Type | Top Mount |
Thermal Resistance @ Natural | - |
Thermal Resistance @ Forced Air Flow | 10.00°C/W @ 200 LFM |
Shape | Square, Fins |
Series | maxiGRIP |
Power Dissipation @ Temperature Rise | - |
Package Cooled | BGA |
Other Names | ATS-53375D-C2-R0 ATS1159 ATS53375DC2R0 |
Material Finish | Black Anodized |
Material | Aluminum |
Manufacturer Standard Lead Time | 6 Weeks |
Length | 1.476" (37.50mm) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Height Off Base (Height of Fin) | 0.374" (9.50mm) |
Diameter | - |
Detailed Description | Heat Sink BGA Aluminum Top Mount |
Attachment Method | Clip, Thermal Material |