Label and body marking of B660B-0.0055-00-1112-NA can be provided after order.
In stock: 59296
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Standard Packaging Integrated Circuit Components B660B-0.0055-00-1112-NA
Usage | - |
---|---|
Type | Sheet, Tape |
Thickness | 0.0055" (0.140mm) |
Thermal Resistivity | 0.58°C/W |
Thermal Conductivity | 0.4 W/m-K |
Shape | Rectangular |
Series | Bond-Ply® 660B |
Outline | 304.80mm x 279.40mm |
Other Names | BG418021 BP660B-0.0055-00-1112 BP660B-0.0055-1112-NA BP660B-0.0055-1112-NA-ND Q2368566 Q3186179 Q4936915A |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Non-Silicone, Polyethylene-Naphthalate (PEN) |
Manufacturer Standard Lead Time | 2 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad White 304.80mm x 279.40mm Rectangular Adhesive - Both Sides |
Color | White |
Backing, Carrier | Polyethylene-Naphthalate (PEN) |
Adhesive | Adhesive - Both Sides |