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Standard Packaging Integrated Circuit Components XC7Z035-2FBG676I
Supplier Device Package | 676-FCBGA (27x27) |
---|---|
Speed | 800MHz |
Series | Zynq®-7000 |
RAM Size | 256KB |
Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells |
Peripherals | DMA |
Packaging | Tray |
Package / Case | 676-BBGA, FCBGA |
Operating Temperature | -40°C ~ 100°C (TJ) |
Number of I/O | 130 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Manufacturer Standard Lead Time | 10 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Flash Size | - |
Detailed Description | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 275K Logic Cells 256KB 800MHz 676-FCBGA (27x27) |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture | MCU, FPGA |