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Standard Packaging Integrated Circuit Components TH58BVG2S3HTAI0
Write Cycle Time - Word, Page | 25ns |
---|---|
Voltage - Supply | 2.7 V ~ 3.6 V |
Technology | FLASH - NAND (SLC) |
Supplier Device Package | 48-TSOP I |
Series | Benand™ |
Packaging | Tray |
Package / Case | 48-TFSOP (0.724", 18.40mm Width) |
Other Names | TH58BVG2S3HTAI0B4H TH58BVG2S3HTAI0YCJ |
Operating Temperature | -40°C ~ 85°C (TA) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Memory Type | Non-Volatile |
Memory Size | 4Gb (512M x 8) |
Memory Interface | Parallel |
Memory Format | FLASH |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | FLASH - NAND (SLC) Memory IC 4Gb (512M x 8) Parallel 25ns 48-TSOP I |
Access Time | 25ns |