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Standard Packaging Integrated Circuit Components ATS-50170B-C1-R0
Width | 0.669" (17.00mm) |
---|---|
Type | Top Mount |
Thermal Resistance @ Natural | - |
Thermal Resistance @ Forced Air Flow | 18.20°C/W @ 200 LFM |
Shape | Square, Angled Fins |
Series | maxiGRIP, maxiFLOW |
Power Dissipation @ Temperature Rise | - |
Package Cooled | BGA |
Other Names | ATS-50170B-C2-R0 ATS1000 ATS50170BC2R0 |
Moisture Sensitivity Level (MSL) | Not Applicable |
Material Finish | Blue Anodized |
Material | Aluminum |
Manufacturer Standard Lead Time | 6 Weeks |
Length | 0.669" (17.00mm) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Height Off Base (Height of Fin) | 0.295" (7.50mm) |
Diameter | - |
Detailed Description | Heat Sink BGA Aluminum Top Mount |
Attachment Method | Clip, Thermal Material |