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Standard Packaging Integrated Circuit Components BP100-0.005-00-1010
Usage | - |
---|---|
Type | Sheet, Tape |
Thickness | 0.0050" (0.127mm) |
Thermal Resistivity | 0.52°C/W |
Thermal Conductivity | 0.8 W/m-K |
Shape | Square |
Series | Bond-Ply® 100 |
Outline | 254.00mm x 254.00mm |
Other Names | BER158 BOND PLY 105 10X10" |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Polyimide |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad White 254.00mm x 254.00mm Square Adhesive - Both Sides |
Color | White |
Backing, Carrier | Fiberglass |
Adhesive | Adhesive - Both Sides |