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Standard Packaging Integrated Circuit Components 374724B60024G
Width | 1.378" (35.00mm) |
---|---|
Type | Top Mount |
Thermal Resistance @ Natural | 15.30°C/W |
Thermal Resistance @ Forced Air Flow | 5.20°C/W @ 200 LFM |
Shape | Square, Pin Fins |
Series | - |
Power Dissipation @ Temperature Rise | 3.0W @ 50°C |
Package Cooled | BGA |
Other Names | 374724B60024 HS326 |
Material Finish | Black Anodized |
Material | Aluminum |
Manufacturer Standard Lead Time | 8 Weeks |
Length | 1.378" (35.00mm) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Height Off Base (Height of Fin) | 0.709" (18.00mm) |
Diameter | - |
Detailed Description | Heat Sink BGA Aluminum 3.0W @ 50°C Top Mount |
Attachment Method | Solder Anchor |