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Standard Packaging Integrated Circuit Components PA-MSD3SM18-08
Size / Dimension | 0.450" L x 0.450" W (11.43mm x 11.43mm) |
---|---|
Series | - |
Proto Board Type | SMD to DIP |
Pitch | 0.026" (0.65mm) |
Package Accepted | MSOP |
Other Names | 309-1120 PA-MSD3SM18-08-ND Q5404492 Q5799823 |
Number of Positions | 8 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | - |
Manufacturer Standard Lead Time | 4 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Board Thickness | - |