Label and body marking of APR55-55-33CB/A01 can be provided after order.
In stock: 56289
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Standard Packaging Integrated Circuit Components APR55-55-33CB/A01
Width | 2.150" (54.60mm) |
---|---|
Type | Top Mount |
Thermal Resistance @ Natural | 5.16°C/W |
Thermal Resistance @ Forced Air Flow | 1.38°C/W @ 200 LFM |
Shape | Square, Pin Fins |
Series | APR |
Power Dissipation @ Temperature Rise | - |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Other Names | APR555533CBA01 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material Finish | Black Anodized |
Material | Aluminum Alloy |
Manufacturer Standard Lead Time | 12 Weeks |
Length | 2.150" (54.60mm) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Height Off Base (Height of Fin) | 1.283" (32.60mm) |
Diameter | - |
Detailed Description | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Alloy Top Mount |
Attachment Method | Thermal Tape, Adhesive (Included) |