In stock: 549
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Standard Packaging Integrated Circuit Components 658-25ABT3
Width | 1.100" (27.94mm) |
---|---|
Type | Top Mount |
Thermal Resistance @ Natural | - |
Thermal Resistance @ Forced Air Flow | 5.00°C/W @ 500 LFM |
Shape | Square, Pin Fins |
Series | 658 |
Power Dissipation @ Temperature Rise | 2.0W @ 40°C |
Package Cooled | BGA |
Other Names | 345-1096 65825ABT3 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material Finish | Black Anodized |
Material | Aluminum |
Manufacturer Standard Lead Time | 12 Weeks |
Length | 1.100" (27.94mm) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Height Off Base (Height of Fin) | 0.250" (6.35mm) |
Diameter | - |
Detailed Description | Heat Sink BGA Aluminum 2.0W @ 40°C Top Mount |
Attachment Method | Thermal Tape, Adhesive (Included) |