Label and body marking of BBN6203BGNY30C can be provided after order.
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Standard Packaging Integrated Circuit Components BBN6203BGNY30C
Voltage - I/O | 3.30V |
---|---|
Voltage - Core | 1.50V |
Type | Fixed Point |
Supplier Device Package | 384-FC/CSP (18x18) |
Series | TMS320C62x |
Packaging | Tray |
Package / Case | 384-FBGA, FCCSPBGA |
Operating Temperature | 0°C ~ 90°C (TC) |
On-Chip RAM | 896kB |
Non-Volatile Memory | External |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Manufacturer Standard Lead Time | 12 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Interface | McBSP |
Clock Rate | 300MHz |