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Standard Packaging Integrated Circuit Components 1731120085
Wire Gauge | - |
---|---|
Type | Power |
Termination Finish Thickness | 200µin (5.08µm) |
Termination Finish | Tin |
Series | FMP, FCT |
Packaging | Bulk |
Other Names | 173112-0085 FMP016P104 WM12705 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Manufacturer Standard Lead Time | 11 Weeks |
Lead Free Status / RoHS Status | Not applicable / Not applicable |
Features | - |
Detailed Description | D-Sub Contact Male Pin Gold Solder, PCB Machined |
Contact Type | Male Pin |
Contact Termination | Solder, PCB |
Contact Size | - |
Contact Material | Copper Alloy |
Contact Form | Machined |
Contact Finish Thickness | 31.5µin (0.80µm) |
Contact Finish | Gold |