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Standard Packaging Integrated Circuit Components SPK4-0.006-00-104
Usage | TO-218, TO-220, TO-247 |
---|---|
Type | Pad, Sheet |
Thickness | 0.0060" (0.152mm) |
Thermal Resistivity | 0.48°C/W |
Thermal Conductivity | 0.9 W/m-K |
Shape | Rectangular |
Series | Sil-Pad® K-4 |
Outline | 25.40mm x 19.05mm |
Other Names | BER221 BG426708 BG90599 K6-104 SPK4000600104 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Silicone Rubber |
Manufacturer Standard Lead Time | 2 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Gray 25.40mm x 19.05mm Rectangular |
Color | Gray |
Backing, Carrier | Polyimide |
Adhesive | - |