Label and body marking of Q3-0.005-00-105 can be provided after order.
In stock: 55408
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Standard Packaging Integrated Circuit Components Q3-0.005-00-105
Usage | SIP |
---|---|
Type | Pad, Sheet |
Thickness | 0.0050" (0.127mm) |
Thermal Resistivity | 0.35°C/W |
Thermal Conductivity | 2.0 W/m-K |
Shape | Rectangular |
Series | Q-Pad® 3 |
Outline | 36.83mm x 21.29mm |
Other Names | BER128 Q3-105 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Elastomer |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Black 36.83mm x 21.29mm Rectangular |
Color | Black |
Backing, Carrier | Fiberglass |
Adhesive | - |