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Standard Packaging Integrated Circuit Components 576802B03700G
Width | 0.500" (12.70mm) |
---|---|
Type | Board Level |
Thermal Resistance @ Natural | 27.30°C/W |
Thermal Resistance @ Forced Air Flow | 7.00°C/W @ 400 LFM |
Shape | Rectangular, Fins |
Series | - |
Power Dissipation @ Temperature Rise | 1.0W @ 30°C |
Package Cooled | TO-220, TO-262 |
Other Names | 041932 HS364 |
Moisture Sensitivity Level (MSL) | Not Applicable |
Material Finish | Black Anodized |
Material | Aluminum |
Manufacturer Standard Lead Time | 7 Weeks |
Length | 0.748" (19.00mm) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Height Off Base (Height of Fin) | 0.500" (12.70mm) |
Diameter | - |
Detailed Description | Heat Sink TO-220, TO-262 Aluminum 1.0W @ 30°C Board Level |
Attachment Method | Clip and PC Pin |