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Standard Packaging Integrated Circuit Components SIR172DP-T1-GE3
Vgs(th) (Max) @ Id | 2.5V @ 250µA |
---|---|
Vgs (Max) | ±20V |
Technology | MOSFET (Metal Oxide) |
Supplier Device Package | PowerPAK® SO-8 |
Series | TrenchFET® |
Rds On (Max) @ Id, Vgs | 8.9 mOhm @ 16.1A, 10V |
Power Dissipation (Max) | 29.8W (Tc) |
Packaging | Cut Tape (CT) |
Package / Case | PowerPAK® SO-8 |
Other Names | SIR172DP-T1-GE3CT |
Operating Temperature | -55°C ~ 150°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds | 997pF @ 15V |
Gate Charge (Qg) (Max) @ Vgs | 30nC @ 10V |
FET Type | N-Channel |
FET Feature | - |
Drive Voltage (Max Rds On, Min Rds On) | 4.5V, 10V |
Drain to Source Voltage (Vdss) | 30V |
Detailed Description | N-Channel 30V 20A (Tc) 29.8W (Tc) Surface Mount PowerPAK® SO-8 |
Current - Continuous Drain (Id) @ 25°C | 20A (Tc) |