In stock: 59556
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Standard Packaging Integrated Circuit Components WB3F200VD1
Series | WB3 |
---|---|
Pitch | 0.020" (0.50mm) |
Packaging | Tray |
Other Names | 670-2350 |
Number of Rows | 2 |
Number of Positions | 200 |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Mated Stacking Heights | 4mm, 5mm |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Height Above Board | 0.098" (2.50mm) |
Features | Board Guide, Solder Retention |
Detailed Description | 200 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold |
Contact Finish Thickness | 30.0µin (0.76µm) |
Contact Finish | Gold |
Connector Type | Receptacle, Center Strip Contacts |