Label and body marking of CSD13306WT can be provided after order.
In stock: 50459
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Standard Packaging Integrated Circuit Components CSD13306WT
Vgs(th) (Max) @ Id | 1.3V @ 250µA |
---|---|
Vgs (Max) | ±10V |
Technology | MOSFET (Metal Oxide) |
Supplier Device Package | 6-DSBGA (1x1.5) |
Series | NexFET™ |
Rds On (Max) @ Id, Vgs | 10.2 mOhm @ 1.5A, 4.5V |
Power Dissipation (Max) | 1.9W (Ta) |
Packaging | Tape & Reel (TR) |
Package / Case | 6-UFBGA, DSBGA |
Other Names | 296-41134-2 |
Operating Temperature | -55°C ~ 150°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Manufacturer Standard Lead Time | 35 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds | 1370pF @ 6V |
Gate Charge (Qg) (Max) @ Vgs | 11.2nC @ 4.5V |
FET Type | N-Channel |
FET Feature | - |
Drive Voltage (Max Rds On, Min Rds On) | 2.5V, 4.5V |
Drain to Source Voltage (Vdss) | 12V |
Detailed Description | N-Channel 12V 3.5A (Ta) 1.9W (Ta) Surface Mount 6-DSBGA (1x1.5) |
Current - Continuous Drain (Id) @ 25°C | 3.5A (Ta) |