Label and body marking of 76693-1170 can be provided after order.
In stock: 57859
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Standard Packaging Integrated Circuit Components 76693-1170
Termination | Press-Fit |
---|---|
Series | EdgeLine 76693 |
Read Out | Dual |
Pitch | 0.031" (0.80mm) |
Packaging | Tray |
Other Names | 076693-1170 076693-1170-E 0766931170 0766931170-E 76693-1170-E 766931170 766931170-E SD-76693-100 |
Operating Temperature | -40°C ~ 85°C |
Number of Rows | 2 |
Number of Positions/Bay/Row | 85 |
Number of Positions | 170 |
Mounting Type | Through Hole |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material - Insulation | Thermoplastic, Glass Filled |
Manufacturer Standard Lead Time | 11 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Gender | Female |
Flange Feature | - |
Features | - |
Contact Type | - |
Contact Material | Copper Alloy |
Contact Finish Thickness | 30.0µin (0.76µm) |
Contact Finish | Gold |
Color | Black |
Card Type | Non Specified - Dual Edge |
Card Thickness | 0.093" (2.36mm) |