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Standard Packaging Integrated Circuit Components 3MIC 3M662XW DLF 3MIL TH 4.25 IN
Weight | - |
---|---|
Type | Lapping Film |
Specifications | Diamond |
Size / Dimension | 4.25" Dia (108.0mm) |
Series | 662XW |
Other Names | 00051111500521 3M10780 3MIC3M662XWDLF3MILTH425IN 60070009307 7100104619 |
Moisture Sensitivity Level (MSL) | Not Applicable |
Manufacturer Standard Lead Time | 3 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
For Use With/Related Products | Fiber Optic Connectors |
Detailed Description | Lapping Film Diamond 4.25" Dia (108.0mm) |