In stock: 10
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Standard Packaging Integrated Circuit Components PA0063-S
Type | QFN/LFCSP |
---|---|
Thickness | 0.0040" (0.102mm) |
Thermal Center Pad | - |
Series | Proto-Advantage |
Pitch | 0.020" (0.50mm) |
Outer Dimension | 0.900" L x 1.300" W (22.86mm x 33.02mm) |
Other Names | PA0063S |
Number of Positions | 20 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Stainless Steel |
Manufacturer Standard Lead Time | 2 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Inner Dimension | 0.157" L x 0.157" W (4.00mm x 4.00mm) |