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Standard Packaging Integrated Circuit Components SP2000-0.015-00-58
Usage | TO-220 |
---|---|
Type | Pad, Sheet |
Thickness | 0.0150" (0.381mm) |
Thermal Resistivity | 0.33°C/W |
Thermal Conductivity | 3.5 W/m-K |
Shape | Rectangular |
Series | Sil-Pad® 2000 |
Outline | 19.05mm x 12.70mm |
Other Names | 2015-58 BER202 BG426649 SP200000150058 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Silicone Elastomer |
Manufacturer Standard Lead Time | 2 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad White 19.05mm x 12.70mm Rectangular |
Color | White |
Backing, Carrier | Fiberglass |
Adhesive | - |