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Standard Packaging Integrated Circuit Components 17553LF
Wire Gauge | 17 AWG, 18 SWG |
---|---|
Type | Wire Solder |
Storage/Refrigeration Temperature | - |
Shelf Life Start | Date of Manufacture |
Shelf Life | 60 Months |
Series | - |
Process | Lead Free |
Other Names | 17553LF-ND 243-1362 |
Moisture Sensitivity Level (MSL) | Not Applicable |
Melting Point | 440°F (227°C) |
Manufacturer Standard Lead Time | 4 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Form | Spool, 3.53 oz (100g) |
Flux Type | Rosin Activated (RA) |
Diameter | 0.047" (1.19mm) |
Detailed Description | Lead Free Rosin Activated (RA) Wire Solder Sn99.3Cu0.7 (99.3/0.7) 17 AWG, 18 SWG Spool, 3.53 oz (100g) |
Composition | Sn99.3Cu0.7 (99.3/0.7) |