Label and body marking of 1717741118 can be provided after order.
In stock: 58093
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Standard Packaging Integrated Circuit Components 1717741118
Termination | Solder |
---|---|
Series | EdgeLine 171774 |
Read Out | Dual |
Pitch | 0.031" (0.80mm) |
Packaging | Bulk |
Operating Temperature | -40°C ~ 105°C |
Number of Rows | 2 |
Number of Positions/Bay/Row | - |
Number of Positions | 118 |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material - Insulation | Thermoplastic |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Gender | Female |
Flange Feature | - |
Features | Board Guide, Board Lock |
Contact Type | Cantilever |
Contact Material | Copper Alloy |
Contact Finish Thickness | 30.0µin (0.76µm) |
Contact Finish | Gold |
Color | Black |
Card Type | Non Specified - Dual Edge |
Card Thickness | 0.062" (1.57mm) |