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Standard Packaging Integrated Circuit Components EYG-N0912QD4P
Usage | Heat Isolation |
---|---|
Type | Insulator Pad, Sheet |
Thickness | 0.0207" (0.525mm) |
Thermal Resistivity | - |
Thermal Conductivity | 0.02 W/m-K |
Shape | Rectangular |
Series | NASBIS |
Outline | 115.00mm x 90.00mm |
Other Names | EYGN0912QD4P P122651 |
Moisture Sensitivity Level (MSL) | Not Applicable |
Material | Silica and Graphite |
Manufacturer Standard Lead Time | 9 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad White 115.00mm x 90.00mm Rectangular Adhesive - One Side |
Color | White |
Backing, Carrier | Polyester |
Adhesive | Adhesive - One Side |