In stock: 55306
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Standard Packaging Integrated Circuit Components SPK10-0.006-00-22
Usage | DO-4 |
---|---|
Type | Pad, Sheet |
Thickness | 0.0060" (0.152mm) |
Thermal Resistivity | - |
Thermal Conductivity | 1.3 W/m-K |
Shape | Round |
Series | Sil-Pad® K-10 |
Outline | 15.87mm x 5.08mm |
Other Names | BER115 K10-22 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Silicone Rubber |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Beige 15.87mm x 5.08mm Round |
Color | Beige |
Backing, Carrier | Polyimide |
Adhesive | - |