Label and body marking of 558-10-504M29-001104 can be provided after order.
In stock: 56473
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Standard Packaging Integrated Circuit Components 558-10-504M29-001104
Type | BGA |
---|---|
Termination Post Length | 0.086" (2.20mm) |
Termination | Solder |
Series | 558 |
Pitch - Post | 0.050" (1.27mm) |
Pitch - Mating | 0.050" (1.27mm) |
Packaging | Bulk |
Operating Temperature | -55°C ~ 125°C |
Number of Positions or Pins (Grid) | 504 (29 x 29) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material Flammability Rating | UL94 V-0 |
Manufacturer Standard Lead Time | 8 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Housing Material | FR4 Epoxy Glass |
Features | Closed Frame |
Current Rating | 1A |
Contact Resistance | 10 mOhm |
Contact Material - Post | Brass |
Contact Material - Mating | Brass |
Contact Finish Thickness - Post | 10.0µin (0.25µm) |
Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
Contact Finish - Post | Gold |
Contact Finish - Mating | Gold |