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Standard Packaging Integrated Circuit Components A2F200M3F-1FG484I
Supplier Device Package | 484-FPBGA (23x23) |
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Speed | 100MHz |
Series | SmartFusion® |
RAM Size | 64KB |
Primary Attributes | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops |
Peripherals | DMA, POR, WDT |
Packaging | Tray |
Package / Case | 484-BGA |
Operating Temperature | -40°C ~ 100°C (TJ) |
Number of I/O | MCU - 41, FPGA - 94 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant |
Flash Size | 256KB |
Detailed Description | ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 256KB 64KB 100MHz 484-FPBGA (23x23) |
Core Processor | ARM® Cortex®-M3 |
Connectivity | EBI/EMI, Ethernet, I²C, SPI, UART/USART |
Base Part Number | A2F200 |
Architecture | MCU, FPGA |