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Standard Packaging Integrated Circuit Components GP1000SF-0.020-02-0816
Usage | - |
---|---|
Type | Pad, Sheet |
Thickness | 0.0200" (0.508mm) |
Thermal Resistivity | - |
Thermal Conductivity | 0.9 W/m-K |
Shape | Rectangular |
Series | Gap Pad® 1000SF |
Outline | 406.40mm x 203.20mm |
Other Names | BER362 BG416758 GP1000SF-0.020-01-0816-NA GP1000SF-0.020-01-0816-NA-ND Q3457040 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Non-Silicone |
Manufacturer Standard Lead Time | 2 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Green 406.40mm x 203.20mm Rectangular Tacky - Both Sides |
Color | Green |
Backing, Carrier | Fiberglass |
Adhesive | Tacky - Both Sides |