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Standard Packaging Integrated Circuit Components AS4C64M16D3B-12BIN
Write Cycle Time - Word, Page | 15ns |
---|---|
Voltage - Supply | 1.425 V ~ 1.575 V |
Technology | SDRAM - DDR3 |
Supplier Device Package | 96-FBGA (13x9) |
Series | - |
Packaging | Tray |
Package / Case | 96-TFBGA |
Operating Temperature | -40°C ~ 95°C (TC) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Memory Type | Volatile |
Memory Size | 1Gb (64M x 16) |
Memory Interface | Parallel |
Memory Format | DRAM |
Manufacturer Standard Lead Time | 8 Weeks |
Detailed Description | SDRAM - DDR3 Memory IC 1Gb (64M x 16) Parallel 800MHz 20ns 96-FBGA (13x9) |
Clock Frequency | 800MHz |
Access Time | 20ns |