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Standard Packaging Integrated Circuit Components XLI98C-10-2.15-P
Width | 0.394" (10.00mm) |
---|---|
Type | Heat Spreader |
Thermal Resistance @ Natural | - |
Thermal Resistance @ Forced Air Flow | - |
Shape | Square |
Series | XL-25 |
Power Dissipation @ Temperature Rise | - |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Other Names | 1168-1967 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material Finish | - |
Material | Ceramic |
Manufacturer Standard Lead Time | 12 Weeks |
Length | 0.394" (10.00mm) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Height Off Base (Height of Fin) | 0.085" (2.15mm) |
Diameter | - |
Detailed Description | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Ceramic Heat Spreader |
Attachment Method | Thermal Tape, Adhesive (Included) |