Label and body marking of ACC70DTMZ-S664 can be provided after order.
In stock: 59185
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Standard Packaging Integrated Circuit Components ACC70DTMZ-S664
Termination | Solder |
---|---|
Series | - |
Read Out | Dual |
Pitch | 0.100" (2.54mm) |
Packaging | Tray |
Operating Temperature | -65°C ~ 150°C |
Number of Rows | 2 |
Number of Positions/Bay/Row | 70 |
Number of Positions | 140 |
Mounting Type | Through Hole, Right Angle |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material - Insulation | Polyphenylene Sulfide (PPS) |
Manufacturer Standard Lead Time | 3 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Gender | Female |
Flange Feature | Flush Mount, Side Opening, Unthreaded, 0.125" (3.18mm) Dia |
Features | - |
Contact Type | Loop Bellows |
Contact Material | Beryllium Copper |
Contact Finish Thickness | 30.0µin (0.76µm) |
Contact Finish | Gold |
Color | - |
Card Type | Non Specified - Dual Edge |
Card Thickness | 0.125" (3.18mm) |