Label and body marking of 573400D00000G can be provided after order.
In stock: 56864
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Standard Packaging Integrated Circuit Components 573400D00000G
Width | 1.220" (30.99mm) |
---|---|
Type | Top Mount |
Thermal Resistance @ Natural | 14.00°C/W |
Thermal Resistance @ Forced Air Flow | 4.00°C/W @ 600 LFM |
Shape | Rectangular, Fins |
Series | - |
Power Dissipation @ Temperature Rise | 1.0W @ 20°C |
Package Cooled | TO-268 (D³Pak) |
Other Names | 041505 573400D00000G-ND HS525 |
Moisture Sensitivity Level (MSL) | Not Applicable |
Material Finish | Tin |
Material | - |
Manufacturer Standard Lead Time | 7 Weeks |
Length | 0.500" (12.70mm) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Height Off Base (Height of Fin) | 0.401" (10.20mm) |
Diameter | - |
Detailed Description | Heat Sink TO-268 (D³Pak) 1.0W @ 20°C Top Mount |
Attachment Method | SMD Pad |